Atomic Layer Deposition of copper - If you like sputtering, you'll love this!

An explanation and demo of atomic layer deposition (ALD) of copper metal on glass. Precursors are copper(I) chloride and hydrogen, processed in a hot-wall tube quartz tube furnace.

10 torr operating pressure
500 sccm argon sweep/purge gas constantly flowing
75 sccm CuCl argon pulse gas (17 seconds including flow controller lag)
100 sccm H pulse gas (14 seconds including flow controller lag)
7 second purge time between pulses
100mm quartz tube furnace diameter
415C deposition temperature
350C CuCl evaporation temperature
Substrates are mostly borosilicate glass cleaned with RCA clean
The "good" samples shown in the video are about 750 cycles (about 9 hours

Main ref:
https://sci-hub.se/https://doi.org/10.1002/cvde.19970030107
Also helpful:
https://sci-hub.se/https://doi.org/10.1063/1.5087759
https://sci-hub.se/10.1149/2.0261501jss
https://sci-hub.se/https://doi.org/10.1016/0022-0248(92)90191-K

Alicat flow controller manuals (hard to find via website navigation):
https://documents.alicat.com/manuals/DOC-MANUAL-MC.pdf
https://documents.alicat.com/manuals/old/Gas_Flow_Controller_Manual_rev7.pdf
https://documents.alicat.com/Alicat-Serial-Primer.pdf

RCA clean: https://en.wikipedia.org/wiki/RCA_clean

CuCl synthesis: http://wwwchem.uwimona.edu.jm/lab_manuals/c1901exp35.html

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